Product Details:
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Demo Board Type: | Others | Function: | EMCP221 Pressure To USB Test Seat |
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Feature: | Bounding Box Of Different Sizes Can Be Replac | Specification: | 11.5x13(mm) |
Products Feature: | There Is No Ball All Can Be Tested | Applicable: | BGA221 |
Shippment: | Free Shipping |
Product Features:
A. Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel, etc--eMMC
B. Apply to BGA221.
C. Accurate positioning on flat bottom pad and solder of eMCP.
D. Long operating life,up to 25,000 times. and faster reading.
E. Apply to eMCP thickness:0.8--1.5mm.
F. Could read and rewrite the data of eMMC with this.
G. eMCP size : 11.5x13mm/ 12x16mm/ 12x18mm/ 14x18mm/ 11x10mm, pitch:0.5mm.
H. Easy to operate,insert the USB into your PC, then could read.
Does not support hot plug, pull out the power switch, respectively support via USB or through the accessories and most of the board should be connecting pin test;