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Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm

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Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm
Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm

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Product Details:
Place of Origin: china
Model Number: DDR96/BGA96
Payment & Shipping Terms:
Minimum Order Quantity: 1cps
Price: $50/pcs(Free shipping - regular logistics)
Packaging Details: 13*8*9 cm
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 3-5 work days

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm

Description
Type1: Test & Burn In SockAet ( Without Pcb ) Type2: Flash & Programming ( With Pcb )
Package: DDR96/BGA96 Pin Pitch: 0.8mm
Pin Count: 96 Pins Chip Size: 13*7.5mm
Contact Resistance: 100mΩ Max Max Current Capacity: 1A/pin
Life Span: 10,000 Times Temperature Range: -45℃ TO 125℃
Purpose: Chip Detection/Aging Test/Chip Programming Socket/Chip Data Recovery Test Stand

Feature :

* 100% brand new , high Quality and duarable

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

Product Feature :

1. Use double contact technology , contact more stable .

2. The socket shell use special engineering plastic , high strength , long mechanical life .

3. The shapnel use import beryllium copper , small impedance , good flexibility .

4. Coating with ticken gold plating layer , contact ticken electroplate , lowest contact resistance , high reliability .

Product performance :

1. Material :

a) Insulator , PEI , PPS

b) beryllium copper( Be Cu )Gold plating Over Nickel plating

2. Electrical Specification :

a) Insulation resistance : 1000m Min,At DC 500V

b) Voltage resistance : 700V AC at 1 min

c) Contact resistance : 100mΩ MAX.

d) PIN feet stretch : 55g/PIN(Normal)

e) Mechanical life : 10000Times

f) Temperature: -45~+125



2.Specification and Dimension :

* Type : Test & Programming Socket ( with pcb )

* Test & Burn in SockAet ( without pcb )

* Package :DDR96/BGA96

* Pinpitch :0.8mm

* Chip size:13*7.5mm

* Max Current Capacity  : 1A/pin



We are the original factory and have our own factory and engineers. If you cannot find the test stand you need, please contact us and we can provide customized services. If you want to purchase in bulk, you can contact us and we can offer more favorable discounts!



*Usage scenario QFN/QFP/BGA/SOP/TSOP/TSSOP/SSOP/LGA/DFN/EMMC/EMCP/SSD/SOT/DDR/WSON/TF/TO/MCU/adapter/programmerHumid heat/yclic tests/Temperature cycling tests/Programmer Adapter Socket/Test Conversion Burner/Programming test stand/PurposeChip/programmateur adaptateur prise/IC Sockets/IC Connector/Adaptateur de programmeur//OVEN box/flash/BURN-IN/detection/Aging test/Chip programming socket/Chip data recovery test stand/Chip adapter/Burn-in socket/Burning socket/ Socket/IC Connector/prise pour/test benchAdaptateur de prises ICadapter/programmer/BURN-IN/flash/programming/Humid heat,cyclic tests/Temperature cycling tests/IC Test/IC/Chip/Socket Converter Module



Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm 0

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm 1

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm 2

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm 3

Ddr96 Bga96-0.8 Test Stand Burn Stand Lower Pressure Aging Stand Ic Solder Stand Chip Size 13 * 7.5mm 4


Contact Details
Shenzhen hongyi electronics Co.,LTD
Send your inquiry directly to us (0 / 3000)