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BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

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BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM
BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

Large Image :  BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

Product Details:
Place of Origin: CHINA
Model Number: DDR/BGA96-0.8
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: $50
Packaging Details: 13*8*9cm
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 3-5 work days

BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM

Description
Operating Temperature: -45°C To +125°C Package Type 1: Test & Burn In Socket ( Without Pcb )
Current Rating: 1A Contact Resistance: 50mΩ
Life Span: 10,000 Times Pitch: 0.8mm,

Product Introduction

A. Product use: Programming and testing stands, aging and testing of BGA96 IC chips

B. Applicable packaging: BGA96 pin spacing 0.8mm

C. Test seat: BGA96-0.8

D. Features: Adopting C-shaped needles for more stable contact and long service life

E. Working temperature: -55 ℃~150 ℃ Current: 1A max

F. Our company can provide specifications (layout drawings), PDF files  CAD

Specifications and dimensions

A. Model: BG96-0.8

B. Pin spacing (mm): 0.8

C. Foot position: 96

D. Chip size: 13 * 7.5mmBGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 0BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 1BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 2BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 3BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 4BGA96-0.8 test stand burning seat DDR chip down pressure aging seat IC welding seat size 13 * 7.5MM 5


Contact Details
Shenzhen hongyi electronics Co.,LTD
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