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QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)

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QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)

QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)
QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)

Large Image :  QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)

Product Details:
Model Number: QFP176-0.5
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: 120.5
Packaging Details: 13*8*9 cm
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 3-5 work days

QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins)

Description
Type1: QFP176 Test & Burn In SockAet Package: QFP176
Pin Pitch: 0.5 Mm Chip Size 1: 24X24mm Excl Pins
Chip Size 2: 26X26 Mm Incl Pins Contact Resistance: 50mΩ
Max Current Capacity: 1A/pin Signal Frequency: 150MHz/pin
SIGNAL RATE: 300Mbps/pin Life Span: 10,000 Times
Temperature Range: -45℃ TO 155℃

Feature :
* 100% brand new , high Quality and duarable
* Technical support and datasheet are available if you need .
* we are the original manufacturer and welcome anyone to be our distribution agents
* Professional manufacturer in all kinds of IC chip testing sockets and adapters.
Product Feature :
1. Use double contact technology , contact more stable .
2. The socket shell use special engineering plastic , high strength , long mechanical life .
3. The shapnel use import beryllium copper , small impedance , good flexibility .
4. Coating with ticken gold plating layer , contact ticken electroplate , lowest contact resistance , high reliability .
Product performance :
1. Material :
a) Insulator , PEI , PPS
b) beryllium copper( Be Cu )Gold plating Over Nickel plating
2. Electrical Specification :
a) Insulation resistance : 1000m Min,At DC 500V
b) Voltage resistance : 700V AC at 1 min
c) Contact resistance : 50mΩ MAX.
d) PIN feet stretch : 55g/PIN(Normal)
e) Mechanical life : 10000Times
f) Max Current Capacity  : 1A/pin
g) Temperature: -45~+125 


2.Specification and Dimension :
* Type : Test & Programming Socket ( with pcb )
* Test & Burn in SockAet ( without pcb )
* Package :QFP176
* Pinpitch :0.5 mm
* Chip size:26X26  mm

We are the original factory and have our own factory and engineers. If you cannot find the test stand you need, please contact us and we can provide customized services. If you want to purchase in bulk, you can contact us and we can offer more favorable discounts!QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) 0QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) 1QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) 2QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) 3QFP176 Flip-Top Aging Socket, 0.5mm Pitch, 125°C High Temp, Chip Body 24X24mm (Excl Pins), 26X26mm (Incl Pins) 4

Contact Details
Shenzhen hongyi electronics Co.,LTD
Send your inquiry directly to us (0 / 3000)