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Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat

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Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat
Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat

Large Image :  Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat

Product Details:
Place of Origin: China
Brand Name: ANDK
Model Number: SOP24 (28) -0.65
Payment & Shipping Terms:
Minimum Order Quantity: 1pcs
Price: $30/pcs(Free shipping - regular logistics)
Packaging Details: 13*8*9 cm
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 3-5 work days

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat

Description
Type1: Test & Burn In SockAet ( Without Pcb ) Type2: Flash & Programming ( With Pcb )
Package: SOP24 Pin Pitch: 0.65 Mm
Pin Count: 24 Pins Chip Size: 4.4 Mm
Contact Resistance: 100mΩ Max Max Current Capacity: 1A/pin
Life Span: 10,000 Times Temperature Range: -45℃ TO 125℃
Purpose: IC Socket/Programmer Adapter Socket/RUN-IN Socket/

1.Specification and Dimension :

* Type : Test & Programming Socket ( with pcb )

* Test & Burn in SockAet ( without pcb )

* Package :SOP24

* Pinpitch :0.65 mm

* Chip size:4.4 mm

* Max Current Capacity  : 1A/pin

* Mechanical life : 10000Times

* Temperature: -45~+125

*Contact resistance : 100mΩ MAX.

* Insulation resistance : 1000m Min,At DC 500V

* Voltage resistance : 700V AC at 1 min

* PIN feet stretch : 55g/PIN(Normal)


2. Material :

*Insulation shell material: PEI, PPS

*Bow shaped metal shrapnel/POGOPIN: beryllium copper (Be Cu) Gold plating over Nickel plating


Product advantages:

1. Use double contact technology ,  contact more stable .

2. The socket shell use special engineering plastic ,  high strength , long mechanical life .

3. The shapnel use import beryllium copper ,  small impedance , good flexibility .

4. Coating with ticken gold plating layer ,  contact ticken electroplate , lowest contact resistance , high reliability .



We are the original factory and have our own factory and engineers. If you cannot find the test stand you need, please contact us and we can provide customized services. If you want to purchase in bulk, you can contact us and we can offer more favorable discounts!

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 0

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 1

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 2

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 3

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 4

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 5

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 6

Sop24 (28) -0.65 With Foot Aging Seat Ots24-0.65 Downward Pressure Test Seat 0.65 Spacing Burning Seat 7




*Usage scenario QFN/QFP/BGA/SOP/TSOP/TSSOP/SSOP/LGA/DFN/EMMC/EMCP/SSD/SOT/DDR/WSON/TF/TO/MCU/adapter/programmerHumid heat/yclic tests/Temperature cycling tests/Programmer Adapter Socket/Test Conversion Burner/Programming test stand/PurposeChip/programmateur adaptateur prise/IC Sockets/IC Connector/Adaptateur de programmeur//OVEN box/flash/BURN-IN/detection/Aging test/Chip programming socket/Chip data recovery test stand/Chip adapter/Burn-in socket/Burning socket/ Socket/IC Connector/prise pour/test benchAdaptateur de prises ICadapter/programmer/BURN-IN/flash/programming/Humid heat, cyclic tests/Temperature cycling tests/IC Test/IC/Chip/Socket Converter Module


Contact Details
Shenzhen hongyi electronics Co.,LTD
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