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Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm

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Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm

Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm
Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm

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Product Details:
Place of Origin: china
Model Number: BGA132
Payment & Shipping Terms:
Minimum Order Quantity: 1pcs
Price: $41/pcs(Free shipping - regular logistics)
Packaging Details: 13*8*9 cm
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 3-5 work days

Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm

Description
Type1: Test & Burn In SockAet ( Without Pcb ) Type2: Flash & Programming ( With Pcb )
Package: BGA132 Pin Pitch: 1.0mm
Pin Count: 132 Pins Chip Size: 13*7.5mm
Contact Resistance: 100mΩ Max Max Current Capacity: 1A/pin
Life Span: 10,000 Times Temperature Range: -45℃ TO 125℃
Purpose: Chip Detection/Aging Test/Chip Programming Socket/Chip Data Recovery Test Stand

Feature :

* 100% brand new , high Quality and duarable

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

Product Feature :

1. Use double contact technology , contact more stable .

2. The socket shell use special engineering plastic , high strength , long mechanical life .

3. The shapnel use import beryllium copper , small impedance , good flexibility .

4. Coating with ticken gold plating layer , contact ticken electroplate , lowest contact resistance , high reliability .

Product performance :

1. Material :

a) Insulator , PEI , PPS

b) beryllium copper( Be Cu )Gold plating Over Nickel plating

2. Electrical Specification :

a) Insulation resistance : 1000m Min,At DC 500V

b) Voltage resistance : 700V AC at 1 min

c) Contact resistance : 100mΩ MAX.

d) PIN feet stretch : 55g/PIN(Normal)

e) Mechanical life : 10000Times

f) Temperature: -45~+125



2.Specification and Dimension :

* Type : Test & Programming Socket ( with pcb )

* Test & Burn in SockAet ( without pcb )

* Package :BGA132

* Pinpitch :1.0mm

* Chip size:13*7.5mm

* Max Current Capacity  : 1A/pin

Bga132-1.0 Down Pressure Aging Seat Nandflash Test Seat Burning Seat Emptying Seat Size 12 * 18mm 0

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We are the original factory and have our own factory and engineers. If you cannot find the test stand you need, please contact us and we can provide customized services. If you want to purchase in bulk, you can contact us and we can offer more favorable discounts!



*Usage scenario QFN/QFP/BGA/SOP/TSOP/TSSOP/SSOP/LGA/DFN/EMMC/EMCP/SSD/SOT/DDR/WSON/TF/TO/MCU/adapter/programmerHumid heat/yclic tests/Temperature cycling tests/Programmer Adapter Socket/Test Conversion Burner/Programming test stand/PurposeChip/programmateur adaptateur prise/IC Sockets/IC Connector/Adaptateur de programmeur//OVEN box/flash/BURN-IN/detection/Aging test/Chip programming socket/Chip data recovery test stand/Chip adapter/Burn-in socket/Burning socket/ Socket/IC Connector/prise pour/test benchAdaptateur de prises ICadapter/programmer/BURN-IN/flash/programming/Humid heat,cyclic tests/Temperature cycling tests/IC Test/IC/Chip/Socket Converter Module


Contact Details
Shenzhen hongyi electronics Co.,LTD
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